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 RFS P5032
5 GHz 802.11a WLAN Power Amplifier
PRELIMINARY DATA SHEET - Rev 1.4
FEATURES
* * * * * * * * * 3.5% EVM @ POUT = +19 dBm with IEEE 802.11a 64 QAM OFDM at 54 Mbps 24.5 dB of Linear Power Gain at 5 GHz Single +3.3 V Supply 3 mm x 3 mm x 0.9 mm LPCC < 1 dB Gain Variation From 4.9 - 5.9 GHz 25 dBm P1dB 170 mA @ POUT = +19 dBm RoHS Compliant MSL 1 Rating
APPLICATIONS
* * 802.11a WLAN 5 GHz Wireless Video Distribution
S32 Package 12 Pin 3 mm x 3 mm x 0.9 mm LPCC
The RFS P5032 is manufactured using advanced InGaP HBT technology that offers state-of-the-art reliability, temperature stability and ruggedness. The IC is RoHS (Restrictions on Hazardous Substances) compliant, and is provided in a 3 mm x 3 mm x 0.9 mm LPCC package optimized for a 50 system.
PRODUCT DESCRIPTION
The ANADIGICS RFS P5032 power amplifier is a high performance InGaP HBT power amplifier IC designed for transmit applications in the 4.9-5.9 GHz bands. The PA exhibits unparalleled linearity and efficiency for IEEE 802.11a WLAN systems under the toughest signal configurations within these standards. The PA is biased by a single +3.3 V supply and consumes ultra-low current in the OFF mode.
VCC1 VCC2
12
11
10
GND
1
VCC
Bias Control
9
RF OUT
RF IN
2
Matching Network
Matching Network
8
RF OUT
GND
3
Bias Control
7
RF OUT
4
VPC 1
5
GND
6
VPC 2
Figure 1: Block Diagram and Pinout
04/2006
RFS P5032 Table 1: Pin Description
PIN 1 N AME GND D ESC R IPTION Ground. C onnect di rectly to PC B ground pattern under IC usi ng the shortest possi ble path. RF Input. RF i nput to power ampli fi er matched to 50 V. Route as coplanar wavegui de usi ng adjacent ground pi ns. RF i nput can be opti mally i mpedance matched wi th shunt capaci tor. Appli cati on ci rcui t shows stub capaci tor. Ground. C onnect di rectly to PC B ground pattern under IC usi ng the shortest possi ble path. Power C ontrol. Power ampli fi er bi as control pi n for stage 1. The recommended use i s for on/off control of the PA. Nomi nally, 0 V appli ed wi ll turn ampli fi er completely off; +3.3 V should be used to set ampli fi er to maxi mum output capabi li ty. At maxi mum output power capabi li ty, thi s pi n wi ll draw approxi mately 1 to 2 mA of current. A seri es resi stor i s used to set the current flow i nto the pi n, thereby controlli ng the overall bi as level of the PA. Ground. C onnect di rectly to PC B ground pattern under IC usi ng the shortest possi ble path. Power C ontrol. Power ampli fi er bi as control pi n for stage 2. The recommended use i s for on/off control of the PA. Nomi nally, 0 V appli ed wi ll turn ampli fi er completely off; +3.3 V should be used to set ampli fi er to maxi mum output capabi li ty. At maxi mum output power capabi li ty, thi s pi n wi ll draw as much as 1 to 2 mA of current. A seri es resi stor i s used to set the current flow i nto the pi n, therefore setti ng overall bi as level of the PA. RF Output. RF output of power ampli fi er can be opti mally i mpedance matched wi th addi ti onal shunt capaci tor enabli ng maxi mum li neari ty. Appli cati on ci rcui t shows stub capaci tor. Thi s pi n i s also used to bi as the 3rd stage power transi stor through an RF choke i nductor. Supply Voltage. Mai n Bi as feed for bi as control ci rcui try on all stages. Supply Voltage. Bi as for power transi stor of stage 2. Typi cally set to +3.3 V. Supply Voltage. Bi as for power transi stor of stage 1. Typi cally set to +3.3 V.
2
RFIN
3
GND
4
V PC 1
5
GND
6
V PC 2
7,8,9
RFOUT
10 11 12
VCC VCC2 VCC3
2
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
RFS P5032
ELECTRICAL CHARACTERISTICS
Table 2: Absolute Minimum and Maximum Ratings
PARAMETER DC Power Supply (VCC, VCC1, VCC2) Power Control Level (VPC1, VPC2) DC Current Consumption RF Input Level (RFIN) Operating Ambient Temperature Storage Temperature
MIN -40 -55
MAX +4.0 +4.0 700 0 +85 +150
UNIT V V mA dB m C C
COMMENTS
Applied to series resistors external to VPC pins. No RF signal applied.
Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability.
Table 3: Operating Ranges
PARAMETER Operating Frequency (f) Supply Voltage (VCC, VCC1, VCC2) Power Control Voltage (VPC) Case Temperature (TC) MIN 4900 +3.0 +2.8 0 -40 TYP +3.3 +3.3 MAX 5900 +3.6 +3.6 +0.5 +85 UNIT MHz V V C PA "ON" (1) PA "SHUTDOWN"
(1)
COMMENTS 802.11a
The device may be operated safely over these conditions; however, parametric performance is guaranteed only over the conditions defined in the electrical specifications. Note: (1) Applied to series resistors external to VPC pins.
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
3
RFS P5032 Table 4: Electrical Specifications - Continuous Wave (TC = +25 C, VCC = +3.3 V, VPC = +3.3 V)
PARAMETER P 1dB Shutdown Current Quiescent Current Input Return Loss Output Return Loss Reverse Isolation Stability (Spurious) MIN 24 77 30 TYP 25 85 -15 -15 40 -65 MAX 5 93 -10 -10 -60 UNIT dB m mA mA dB dB dB dB c 6:1 VSWR, POUT = +22 dBm; -40 OC 5 GHz Bias = 0 V VPC = +3.3 V, VCC = +3.3 V, RF = Off with application circuit with application circuit COMMENTS
4
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
RFS P5032 Table 5: Electrical Specifications - IEEE 802.11a (TC = +25 C, VCC = +3.3 V, VPC = +3.3 V, 64 QAM OFDM 54 Mbps)
PARAMETER Operating Frequency Power Gain Gain Ripple MIN 4900 23.5 160 TYP 24.5 60.5 3.5 -29 4.5 -27 170 -40 -40 MAX 5900 25.5 4.5 -27 5.5 -25 180 -35 -35 UNIT MHz dB dB % dB % dB mA POUT = +19 dBm Across any 100 MHz band POUT = +19 dBm, 4.90 - 5.35 GHz 802.11a 54 Mbps data rate POUT = +19 dBm, 5.35 - 5.85 GHz 802.11a 54 Mbps data rate POUT = +19 dBm COMMENTS
Error Vector Magnitude (EVM) (1)
Current Consumption Harmonics 2fo 3fo
dB c
POUT = +20 dBm
Note: (1) EVM includes system noise floor of 1% (-40 dB).
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
5
RFS P5032
PERFORMANCE DATA
Figure 2: Gain, ICC and EVM vs. Output Power Across Frequency (VCC = +3.3V, TC = +25oC) 802.11a 54 Mbps OFDM
30 28 26 24 22 Gain 300 280 260 240 220 200 Gain 4.90 GHz Gain 5.25 GHz Gain 5.55 GHz
Gain (dB), EVM (%)
20 18 16 14 12 10 8 6 4 2 0 10 11 12 13 14 15 16 17 18 19 20 21 EVM Current
Current (mA)
180 160 140 120 100 80 60 40 20 0
Gain 5.85 GHz EVM 4.90 GHz EVM 5.25 GHz EVM 5.55 GHz EVM 5.85 GHz Current 4.90 GHz Current 5.25 GHz Current 5.55 GHz Current 5.85 GHz
Output Power (dBm)
Figure 3: Gain, ICC and EVM vs. Output Power Across Power Supply Voltage (Freq = 5.25GHz, TC = +25oC) 802.11a 54 Mbps OFDM
30 28 26 24 22 300
Gain
280 260 240 220 200 Gain 3.0V Gain 3.3V
Gain (dB), EVM (%)
20 18 16 14 12 10 8 6 4 2 0 10 11 12 13 14 15 16 17 18 19 20 21
Current (mA)
180 160 140
Gain 3.6V EVM 3.0V EVM 3.3V EVM 3.6V Current 3.0V Current 3.3V Current 3.6V
Current
120 100 80
EVM
60 40 20 0
Output Power (dBm)
6
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
RFS P5032
Figure 4: Gain, ICC and EVM vs. Output Power Across Temperature (Freq = 5.25 GHz, VCC = +3.3 V) 802.11a 54 Mbps OFDM
30 28 26 24 22
Gain
300 280 260 240 220 200 180 160 140
Current Gain -40C Gain +25C
Gain (dB), EVM (%)
20 18 16 14 12 10 8 6 4 2 0 10 11 12 13 14 15 16 17 18 19 20 21
EVM
Current (mA)
Gain +85C EVM -40C EVM +25C EVM +85C Current -40C Current +25C Current +85C
120 100 80 60 40 20 0
Output Power (dBm)
Figure 5: Input Return Loss vs. Frequency Across Temperature (VCC = +3.3 V)
0 -2 -4 -6
Input Return Loss (dB)
-8 -10 -12 -14 -16 -18 -20 -22 -24 -26 -28 4.90
S11 +85C S11 +25C S11 -40C
5.00
5.10
5.20
5.30
5.40
5.50
5.60
5.70
5.80
Frequency (GHz)
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
7
RFS P5032
Figure 6: Output Return Loss vs. Frequency Across Temperature (VCC = +3.3 V)
0 -2 -4
Output Return Loss (dB)
-6 -8 -10 -12 -14 -16 -18 -20 4.90
S22 +85C S22 +25C S22 -40C
5.00
5.10
5.20
5.30
5.40
5.50
5.60
5.70
5.80
Frequency (GHz)
8
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
RFS P5032
APPLICATION INFORMATION
VCC
+
C10 16 V 10 F 20 % C2 0.1 F 10 %
C14 0.1 F 10 %
C4 0.1 F 10 % C6 0.1 F 10 % C11 10 pF 0.5 pF L1 2.7 nH 0.3 nH
C13 R4 30.1 1 % 1.5 pF 0.25 pF
C3 4.7 pF 0.25 pF
12 11
VC C 2
Stub 30 mils x 115 mils
VC C 1
VC C 10
1 2 3
GND
RF IN
9
RF OUT
C7 8
RFIN
GND
VPC1
RFS P5032
GND
RF OUT RF OUT
RFOUT
1.5 pF 0.25 pF
7
VPC2
170 mils
R1 255 1 % C8
45 mils
R2 750 1 %
Stub 30 mils x 90 mils
5
4
6
**NOTES**
1. RF traces should be 18 mils wide with 20 mils of clearance. 2. DC traces should be 8 mils wide with 10 mils of clearance. 3. Trace widths and clearances apply to application circuit on 10 mil FR4. 4. Pins 1 and 3 should be tied directly to PCB ground pattern under the power amplifier, and should form a coplanar waveguide for the RF In. Ground should also provide a coplanar waveguide for the RF Out.
1000 pF 10 %
Q2 3 E1 C1 2
VCC
4 1 E2 C2 Philips BCV62 or Equivalent
Q1 Current-Fixing Circuit
GND
3 R9 2.74 K 1 %
1 On/Off
OUT
IN
2
Rohm DTC143EE or Equivalent
Figure 7: Application Circuit
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
9
RFS P5032
PACKAGE OUTLINE
C 4 A I G 12 1 B H Pin 1
Index Area
D
F E Bottom View
Top View MILLIMETERS DIMENSION A B C D E F G H I MIN 2.90 2.90 0.80 0.00 1.50 TYP MAX 3.00 3.10 3.00 3.10 0.90 1.00 0.02 0.05 1.65 1.80 1.00 BSC. 0.180 0.250 0.300 0.50 BSC. 0.35 0.40 0.45
Side View
1. All dimensions are in millimeters, angles in degrees. 2. The terminal #1 identifier and pad numbering convention . shall conform to JESD 95-1 SPP-012 3. Lead coplanarity: 0.05 max. 4. Dimension applies to metalized pad and is measured between 0.25 and 0.30 MM from pad tip.
Figure 8: S32 Package Outline - 12 Pin 3 x 3 x 0.9 mm LPCC
TOP BRAND
NOTES:
1. Pin 1 INDICATOR: 2. ANADIGICS LOGO SIZE: 3. TEXT: 4. PART NUMBER: LASER MARK N/A TYPE: ELITE SIZE: 1.5 Point AN = PART NUMBER 1 = CURRENT ISSUE NUMBER OF BOM R = RoHS COMPLIANCE YWW = LAST DIGIT OF YEAR, TWO DIGIT WORK WEEK ZZZ = LAST THREE DIGITS OF LOT NUMBER X = C for CHINA, H for HONG KONG, T for THAILAND, W for TAIWAN, P for PHILIPPINES, I for INDONESIA
AN1R YWW ZZZX
5. YEAR AND WORK WEEK: 6. WAFER LOT NUMBER: 7. COUNTRY CODE:
Figure 9: Branding Specification 10
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
RFS P5032
NOTES
PRELIMINARY DATA SHEET - Rev 1.4 04/2006
11
RFS P5032
ORDERING INFORMATION
ORDER NUMBER TEMPERATURE RANGE -40 C to +85C PACKAGE DESCRIPTION 12 P i n 3 mm x 3 mm x 0.9 mm LP C C 12 P i n 3 mm x 3 mm x 0.9 mm LP C C 12 P i n 3 mm x 3 mm x 0.9 mm LP C C 12 P i n 3 mm x 3 mm x 0.9 mm LP C C COMPONENT PACKAGING
RFS5032RS32Q1
1,000 piece Tape and Reel
RFS5032RS32P0
-40 C to +85C
1-999 piece Tubes
RFS5032RS32P6
-40 C to +85C
1-999 piece Tray
EVA5032RS32
-40 C to +85C
1 piece Evaluation Board
ANADIGICS, Inc.
141 Mount Bethel Road Warren, New Jersey 07059, U.S.A. Tel: +1 (908) 668-5000 Fax: +1 (908) 668-5132 URL: http://www.anadigics.com E-mail: Mktg@anadigics.com IMPORTANT NOTICE
ANADIGICS, Inc. reserves the right to make changes to its products or to discontinue any product at any time without notice. The product specifications contained in Advanced Product Information sheets and Preliminary Data Sheets are subject to change prior to a product's formal introduction. Information in Data Sheets have been carefully checked and are assumed to be reliable; however, ANADIGICS assumes no responsibilities for inaccuracies. ANADIGICS strongly urges customers to verify that the information they are using is current before placing orders.
WARNING
ANADIGICS products are not intended for use in life support appliances, devices or systems. Use of an ANADIGICS product in any such application without written consent is prohibited.
12
PRELIMINARY DATA SHEET - Rev 1.4 04/2006


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